3D printed bracket solves an issue with Alder Lake's LGA1700 socket

A known problem involving motherboards for Intel Alder Lake processors with LGA1700 socket concerns the Independent Loading Mechanism (ILM), which could exert excessive pressure on the CPU and lead to its eventual buckling. This causes an anomalous rise in temperature, although the perfect functioning of the processor is guaranteed.

Australian overclocker Karta has thought of a way to solve the situation, by 3D printing a special custom bracket that allows you to exercise less pressure on the processor. The effectiveness of this solution was tested by Luumi, who posted a video on Youtube to show the results obtained.



Photo Credit: YouTube - Luumi if (jQuery ("# crm_srl-th_hardware_d_mh2_1 "). is (": visible ")) {console.log (" Edinet ADV adding zone: tag crm_srl-th_hardware_d_mh2_1 slot id: th_hardware_d_mh2 "); } It is certainly not the first time that some enthusiasts have dedicated themselves to the issue. For example, last month we told you about the solution implemented by the well-known German portal Igor's Lab, which had inserted some M4 washers on the socket holder. In practice, the first step consisted in removing the four M4 Torx T20 screws that held the ILM in place, then placing the M4 washers in each hole and, finally, putting the four screws back on and screwing them on. Igor's Lab's solution had proved to be efficient, as it was able to lower temperatures by 5 ° C.

However, the same did not happen with the 3D printed bracket. Luumi, on the occasion of his tests carried out on a configuration composed of an Intel Core i5-12600K and an EVGA Z690 Dark Kingpin motherboard, in fact noticed that the presence or absence of the adapter provided less than a degree of difference, but the overclocker blamed this disappointing result on the waterblock employed, which already possessed a convex contour from previous use.

Luumi said he will test the bracket again in the future when he has an undeformed waterblock. At the most, further changes related to height will have to be made to improve its performance in the field.